DocumentCode :
664572
Title :
A finite 3D field simulation method for permittivity gradient implementation of a novel porosification process in LTCC
Author :
Talai, Armin ; Steinhauser, Frank ; Schmid, Ulrich ; Weigel, Robert ; Bittner, Achim ; Koelpin, Alexander
Author_Institution :
Inst. for Electron. Eng., Friedrich-Alexander-Univ. Erlangen-Nuremberg, Erlangen, Germany
fYear :
2013
fDate :
2-7 June 2013
Firstpage :
1
Lastpage :
4
Abstract :
High frequency substrates show a manifold variety of complex permittivities for different applications. Recent research results demonstrated the possibility of local decrease of the permittivity on LTCC by chemical etching processes, which enables the design of high quality antennas on LTCC. This paper shows a novel approach on the determination of the quantitative reduction of the effective permittivity by scanning electron microscope analyses in combination with finite 3D field simulations of the resulting inhomogeneous material. By the characterization of two different porosified LTCCs it could be shown that this process is suitable for direct antenna integration on glass-ceramic substrates with enhanced values of relative permittivities.
Keywords :
ceramics; permittivity; scanning electron microscopes; LTCC; chemical etching processes; complex permittivities; direct antenna integration; finite 3D field simulation method; finite 3D field simulations; glass ceramic substrates; high frequency substrates; high quality antennas; inhomogeneous material; low temperature cofired ceramics; manifold variety; permittivity gradient implementation; porosification process; scanning electron microscope analysis; Copper; Materials; Microstrip; Permittivity; Field simulation; LTCC; inhomogeneous substrate; local reduction of permittivity; permittivity gradient; porosification; wet chemical etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location :
Seattle, WA
ISSN :
0149-645X
Print_ISBN :
978-1-4673-6177-4
Type :
conf
DOI :
10.1109/MWSYM.2013.6697583
Filename :
6697583
Link To Document :
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