• DocumentCode
    664636
  • Title

    Vertically-aligned nano-scale integrated inductors

  • Author

    Seilis, Aaron ; Daneshmand, Mojgan ; Moez, Kambiz ; Taschuk, Michael ; Brett, Marko

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Alberta, Edmonton, AB, Canada
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    We demonstrate a novel method to realize ultra-miniaturized on-chip vertical inductors for use in microwave and millimeter-wave devices. The inductor consists of a thin film of closely-packed, vertically aligned nickel nano-posts. The film is fabricated using a glancing angle physical vapor deposition method, which is CMOS compatible. The resulting nanostructured inductors were measured from 10 GHz to 70 GHz and were found to have inductances of 0.1 nH, resulting in 6pH μιη"2, 60 times larger than previously reported planar inductors. A quality factor of 3 is measured and the results indicate that it continues to improve above 70 GHz, while inductance remains constant. Such nanostructured posts could potentially lead to ultra-small, ultra-wideband inductors to preserve space in integrated circuits.
  • Keywords
    inductors; microwave devices; millimetre wave devices; nanotechnology; vapour deposition; closely packed nickel nanoposts; frequency 10 GHz to 70 GHz; glancing angle physical vapor deposition method; integrated circuits; microwave devices; millimeter wave devices; nanostructured inductors; ultra miniaturized on chip vertical inductors; vertically aligned nanoscale integrated inductors; vertically aligned nickel nanoposts; Films; Inductance; Inductors; Nickel; Q-factor; Substrates; Inductors; glancing angle deposition; magnetic materials; millimeter wave measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697647
  • Filename
    6697647