DocumentCode
664639
Title
New method for temperature dependent dielectric property investigation in polymer composite materials
Author
Willert-Porada, M.A. ; Park, H.S. ; Rosin, Argo
Author_Institution
Univ. of Bayreuth, Bayreuth, Germany
fYear
2013
fDate
2-7 June 2013
Firstpage
1
Lastpage
4
Abstract
Industrial processing of products made from light weight fiber reinforced composites could benefit from microwave heating providing the temperature dependent dielectric properties of the composite materials are known. Three methods of permittivity measurement at ambient temperature are compared: cavity perturbation, coaxial probe and SPDR, Split-Post Dielectric Resonator. The measured values differ significantly for each setup. Therefore a reverse simulation is performed. It is based on a new approach which utilizes the slope, ΔT/Δt of microwave heating curves recorded in a cavity perturbation type setup as indicative for changes in the imaginary part of the permittivity. Two simulation tools are compared: COMSOL® and Quickwave®.
Keywords
carbon fibre reinforced plastics; dielectric losses; dielectric resonators; fabrics; filled polymers; glass fibre reinforced plastics; heat treatment; laminates; melt infiltration; permittivity; woven composites; C; COMSOL; Quickwave; SPDR; SiO2; ambient temperature; cavity perturbation; coaxial probe; dielectric loss; glass-polyurethane composites; industrial processing; laminated polymer composite materials; light weight fiber reinforced composites; microwave heating curve; permittivity; polypropylene-glass fiber reinforced composites; simulation tools; split-post dielectric resonator; temperature dependent dielectric properties; woven carbon fiber fabric infiltrated polymer composites; Electromagnetic heating; Microwave measurement; Microwave theory and techniques; Permittivity; Permittivity measurement; Composite materials; dielectric loss; dielectric measurements; manufacturing processes; materials processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location
Seattle, WA
ISSN
0149-645X
Print_ISBN
978-1-4673-6177-4
Type
conf
DOI
10.1109/MWSYM.2013.6697650
Filename
6697650
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