• DocumentCode
    664639
  • Title

    New method for temperature dependent dielectric property investigation in polymer composite materials

  • Author

    Willert-Porada, M.A. ; Park, H.S. ; Rosin, Argo

  • Author_Institution
    Univ. of Bayreuth, Bayreuth, Germany
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Industrial processing of products made from light weight fiber reinforced composites could benefit from microwave heating providing the temperature dependent dielectric properties of the composite materials are known. Three methods of permittivity measurement at ambient temperature are compared: cavity perturbation, coaxial probe and SPDR, Split-Post Dielectric Resonator. The measured values differ significantly for each setup. Therefore a reverse simulation is performed. It is based on a new approach which utilizes the slope, ΔT/Δt of microwave heating curves recorded in a cavity perturbation type setup as indicative for changes in the imaginary part of the permittivity. Two simulation tools are compared: COMSOL® and Quickwave®.
  • Keywords
    carbon fibre reinforced plastics; dielectric losses; dielectric resonators; fabrics; filled polymers; glass fibre reinforced plastics; heat treatment; laminates; melt infiltration; permittivity; woven composites; C; COMSOL; Quickwave; SPDR; SiO2; ambient temperature; cavity perturbation; coaxial probe; dielectric loss; glass-polyurethane composites; industrial processing; laminated polymer composite materials; light weight fiber reinforced composites; microwave heating curve; permittivity; polypropylene-glass fiber reinforced composites; simulation tools; split-post dielectric resonator; temperature dependent dielectric properties; woven carbon fiber fabric infiltrated polymer composites; Electromagnetic heating; Microwave measurement; Microwave theory and techniques; Permittivity; Permittivity measurement; Composite materials; dielectric loss; dielectric measurements; manufacturing processes; materials processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697650
  • Filename
    6697650