• DocumentCode
    664658
  • Title

    A novel integrated dielectric-and-conductive ink 3D printing technique for fabrication of microwave devices

  • Author

    Ahmadloo, Majid ; Mousavi, Parvin

  • Author_Institution
    TRTech, Edmonton, AB, Canada
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In this work a novel combination of printed electronics using conductive nanoparticle ink together with 3D printing of dielectric material is presented as one integrated process. This allows fabrication of complicated 3D electromagnetic (EM) structures such as wide range of different antennas and microwave devices to simultaneously include printing of conductive nanoparticle ink within 3D dielectric configurations. Characterization of conductive ink and polymer based substrate has been done to ensure proper RF, electric, thermal and mechanical performance of both substrate and the ink. A meander line dipole antenna on a V-shaped substrate is printed and tested to demonstrate the efficiency and accuracy of proposed technique. The goal in this paper is to provide a low cost, environmentally friendly integrated process for the fabrication of geometrically complicated 3D electromagnetic structures.
  • Keywords
    dielectric materials; dipole antennas; ink; microwave antennas; nanoparticles; polymer blends; printed circuit manufacture; substrates; three-dimensional printing; 3D EM structures; 3D electromagnetic structures; 3D printing; V-shaped substrate; conductive nanoparticle ink; dielectric material; meander line dipole antenna; microwave devices; polymer based substrate; printed electronics; Antenna measurements; Dipole antennas; Fabrication; Ink; Printing; Substrates; Three-dimensional displays; 3D printing; Nano-particle conductive ink; fabrication of microwave structures; printed meander antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697669
  • Filename
    6697669