DocumentCode
664666
Title
A 200 GHz GaAs Schottky-diode phase shifter integrated on a silicon-on-insulator substrate
Author
Alijabbari, Naser ; Weikle, Robert M.
Author_Institution
Charles L. Brown Dept. of Electr. & Comput. Eng., Univ. of Virginia, Charlottesville, VA, USA
fYear
2013
fDate
2-7 June 2013
Firstpage
1
Lastpage
4
Abstract
A planar GaAs based Schottky-diode phase-shifter, fabricated on a silicon-on-insulator (SOI) substrate is described. To the best of the authors´ knowledge, this is the first time an integrated Schottky diode circuit has been fabricated monolithically from GaAs and bonded to SOI. Previous work on GaAs-SOI wafer bonding has focused on creating optoelectronic devices that take advantage of silicon microfabrication methods. In this work, GaAs is bonded to SOI and processed to realize a fully integrated submillimeter wave phase shifter. This approach reduces the circuit profile, eases circuit assembly and allows for flexible geometry definition. The circuit described is capable of modulating the phase of a reflected signal by 180° with 8-10 dB of return loss. To achieve this phase shift, two integrated tuning elements, one in series and a second in shunt, are incorporated into the design. These elements resonate as an open and a short at different diode bias voltages and to create the resulting phase shift.
Keywords
Schottky diodes; assembling; gallium arsenide; geometry; microfabrication; millimetre wave phase shifters; optoelectronic devices; silicon-on-insulator; GaAs; SOI substrate; Schottky-diode phase shifter; circuit assembly; flexible geometry definition; frequency 200 GHz; optoelectronic devices; silicon microfabrication methods; silicon-on-insulator substrate; submillimeter wave phase shifter; Gallium arsenide; Integrated circuit modeling; Phase shifters; Probes; Schottky diodes; Silicon; Substrates; GaAs Schottky diodes; Millimeter wave integrated circuits; SOI; phase shifter;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location
Seattle, WA
ISSN
0149-645X
Print_ISBN
978-1-4673-6177-4
Type
conf
DOI
10.1109/MWSYM.2013.6697677
Filename
6697677
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