• DocumentCode
    664732
  • Title

    A Ku-band miniaturized microwave ablation system integrated on a micromachined silicon applicator

  • Author

    Kihyun Kim ; Namgon Kim ; Sung-Hyun Hwang ; Taeyoon Seo ; Sangho Lee ; Yong-Kweon Kim ; Youngwoo Kwon

  • Author_Institution
    Dept. of EECS & INMC, Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A fully integrated thermal ablation system on a micromachined silicon platform is developed for low-power microwave hyperthermia at Ku-band. The heat applicator has been fabricated using Microelectromechanical Systems (MEMS) technology for miniaturization and integration with the active circuits. A Ku-band source module consisting of a voltage controlled oscillator, a driver amplifier, and a high power amplifier has been implemented in monolithic microwave integrated circuits (MMIC´s) and integrated on the applicator platform together with a directional coupler and power detectors for power monitoring. The fully integrated heat applicator was realized in a small form factor of 8 mm × 56 mm × 0.6 mm. In-vitro and In-vivo ablation experiments have been performed on pork muscle/fat and human-cancer xenografted nude mouse, respectively. Temperature rise to over 46 °C has been achieved using only 1.2 W of on-board source power.
  • Keywords
    bioMEMS; fats; hyperthermia; microwave heating; muscle; MEMS technology; Microelectromechanical Systems; form factor; high power amplifier; human cancer xenografted nude mouse; low power microwave hyperthermia; micromachined silicon applicator; miniaturized microwave ablation system; monolithic microwave integrated circuits; pork fat; pork muscle; power 1.2 W; power monitoring; thermal ablation system; voltage controlled oscillator; Applicators; Electromagnetic heating; Hyperthermia; Microwave amplifiers; Muscles; Silicon; Active applicator; hyperthermia; microelectromechanical systems (MEMS); planar coaxial; stacked FET;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697743
  • Filename
    6697743