Embedded wafer level ball grid array (eWLB) technology for high-frequency system-in-package applications

The embedded wafer level ball grid array (eWLB) is a novel system integration platform introduced recently. The eWLB technology is an attractive solution for high-frequency system-in-package (SiP) integration due to the capability to design high-quality (high-Q) embedded passives in the fan-out region and side-by-side multichip integration possibilities. In this paper, we show examples of using the fan-out region and the thin-film redistribution layer (RDL) advantageous for integration of inductors and antennas into an eWLB package. In addition, the use of the through encapsulant via (TEV) technology can extend the integration capabilities to 3D. We present measurement and simulation results of vertical interconnections realized using the RDL and TEVs of the eWLB. We demonstrate that the fan-out area of the eWLB can be used for the design of passive devices using the combination of TEV and RDL structures. We show examples of 3D inductors and transformers integrated in the eWLB. We present a fully integrated single-chip 60-GHz transceiver integrated in the eWLB package together with two dipole antennas as an example of mm-wave system integration.