Integrated microfluidic cooling for GaN devices on multilayer organic LCP substrate

Author

Chlieh, Outmane Lemtiri ; Morcillo, C.A.D. ; Pavlidis, Spyridon ; Khan, Wasif T. ; Papapolymerou, John

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2013

fDate

2-7 June 2013

Firstpage

1

Lastpage

4

Abstract

This paper presents, for the first time, an integrated microfluidic cooling scheme on multilayer organic liquid crystal polymer (LCP) substrate for high power X-band gallium nitride (GaN) devices and amplifiers. The channel is micromachined on LCP and a mixture of water and ethylene glycol is used as a coolant. A 3D electro-thermal model of the microfluidic channel has been created, which illustrates the advantage of having a micro-channel beneath LCP in the case of a static and moving fluid. Measurements were done at 10.5 GHz on a GaN power amplifier (P_DC = 1.68 W, PAE = 15 %) that was placed both on LCP and on a microfluidic channel with a static fluid.

Keywords

amplifiers; coolants; cooling; gallium compounds; liquid crystal polymers; microfluidics; 3D electro-thermal model; GaN; amplifiers; coolant; ethylene glycol; high power X-band gallium nitride devices; integrated microfluidic cooling; liquid crystal polymer; microfluidic channel; multilayer organic LCP substrate; Copper; Fluids; Gallium nitride; Heat sinks; Microfluidics; Radio frequency; Substrates; LCP; channel; heat sink; microfluidic; organic;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International

Conference_Location

Seattle, WA

ISSN

0149-645X

Print_ISBN

978-1-4673-6177-4

Type

conf

DOI

10.1109/MWSYM.2013.6697787

Filename

6697787