DocumentCode
664838
Title
A 10 GbE TCP/IP hardware stack as part of a protocol acceleration platform
Author
Langenbach, Ulrich ; Berthe, A. ; Traskov, Boris ; Weide, S. ; Hofmann, Klaus ; Gregorius, Peter
fYear
2013
fDate
9-11 Sept. 2013
Firstpage
381
Lastpage
384
Abstract
With the increasing number of Internet services, the flexible and reliable TCP/IP protocol suite has become a standard for network communication. TCP/IP is the underlying protocol used for ordered, connection-oriented data transfers over the Internet. Also in the application field of embedded systems TCP/IP has become the protocol suite of choice, because of interoperability across the Internet. The next generation of embedded communication solutions will address 10 Gbps and more due to the growing demand for low round-trip times and high throughput. This paper presents a fully hardwired 10 GbE TCP/IP stack, designed a tightly coupled system integrating higher-level protocols and application-specific logic in order to build a fully integrated and accelerated communication stack as part of an FPGA or ASIC design. The advantages of using a hardware-based 10 GbE TCP/IP stack in terms of latency and throughput are illustrated in this paper by comparing its performance with that of state-of-the-art network interface cards in conjunction with software-based TCP/IP stacks.
Keywords
Internet; embedded systems; network interfaces; open systems; transport protocols; ASIC design; FPGA design; Internet services; TCP/IP hardware stack; TCP/IP protocol suite; application-specific logic; bit rate 10 Gbit/s; communication stack; embedded communication solutions; embedded systems; interoperability; network communication; network interface cards; ordered connection-oriented data transfers; protocol acceleration platform; software-based TCP/IP stacks; Field programmable gate arrays; Hardware; Histograms; IP networks; Protocols; Software; Standards;
fLanguage
English
Publisher
ieee
Conference_Titel
Consumer Electronics ?? Berlin (ICCE-Berlin), 2013. ICCEBerlin 2013. IEEE Third International Conference on
Conference_Location
Berlin
Print_ISBN
978-1-4799-1411-1
Type
conf
DOI
10.1109/ICCE-Berlin.2013.6697997
Filename
6697997
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