Title :
Table of contents
Abstract :
The following topics are dealt with: 2.5 packages; 3D packages; interconnections; wafer level packaging; MEMS; modules; sensor; design for functionality; design for reliability; thermal modelling; mechanical modelling; electrical modelling; biomedical sensors; flip-chip interconnections; and space applications.
Keywords :
biosensors; flip-chip devices; micromechanical devices; wafer level packaging; 2.5 packages; 3D packages; MEMS; biomedical sensors; design for functionality; design for reliability; electrical modelling; flip-chip interconnections; mechanical modelling; modules; space applications; thermal modelling; wafer level packaging;
Conference_Titel :
Microelectronics Packaging Conference (EMPC) , 2013 European
Conference_Location :
Grenoble
