Coupling experimental and modelling results for device failure anticipation

Saving time and money is a key and nowadays major issue in all fields and structures (whatever industry or lab). However, component reliability should not suffer from shorter development time ! An emerging approach to decrease model development time and errors is to use real measurements data to implement the models. For several types of application (electronic, power, adhesive), a methodology was developed to determine relevant mechanical properties of interfaces for improving stress and deformation prediction. Thus, the approach can be applied not only to samples built in laboratories but also to commercial assemblies coming from massive manufacturing. In this paper, we propose several examples of successful combination of measurements and modeling for adhesive development and for power devices. The measurements are done with TDM, the system developed by Insidix to characterize warpage variation during reflow or cycle.