Computational modeling of electrodepostion in small features under megasonic agitation

This paper considers copper electrodeposition processes in microvias and verifies whether the quality of electroplating can be improved in the presence of acoustic streaming generated by a megasonic transducers placed into a plating cell. Our numerical experiments demonstrate that an improvement of cupric ion transport is observed in the area close to the mouth of a via, and that leads to fillings of better quality compared to those achieved under basic conditions. On the other hand, acoustic streaming inside the via has no major impact. The reasons for this lack of impact are different for blind vias and through vias.