Novel interconnection technology for flex-on-glass (FOG) applications

Author

Haksun Lee ; Yong-Sung Eom ; Hyun-Cheol Bae ; Kwang-Seong Choi

Author_Institution

IT Mater. & Components Lab., Electron. & Telecommun. Res. Inst., Daejeon, South Korea

fYear

2013

fDate

9-12 Sept. 2013

Firstpage

1

Lastpage

5

Abstract

Interconnections using anisotropic conductive films (ACF) were dominant in applications for flat-panel displays. However, a novel bonding mechanism for flex-on-glass interconnection is presented. Using SBM (Solder Bump Maker) technology, SnAgCu solder bumps were created on a glass substrate with a uniform height. Then, the glass substrate is thermo-compression bonded with a flexible PCB using a multifunctional bonding material called “Fluxing underfill”. The interconnection using solder and underfill method was analyzed through cross-sectional SEM image. Contact resistance values in the order of 10^-4 Ω, which is about two times lower than that of the conventional ACFs, were obtained. Preliminary results on cross-section analysis and contact resistance measurement indicate the novel bonding mechanism using the Fluxing underfill has a potential for applications in display interconnections.

Keywords

anisotropic media; display instrumentation; interconnections; scanning electron microscopy; solders; tin compounds; PCB; SBM; SnAgCu; anisotropic conductive films; contact resistance values; cross-sectional SEM image; display interconnections; flex-on-glass applications; fluxing underfill; glass substrate; interconnection technology; multifunctional bonding material; solder bump maker technology; thermo-compression; Bonding; Contact resistance; Glass; Joints; Reliability; Substrates; FOG; Fluxing underfill; display interconnection; flex-on-glass;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Packaging Conference (EMPC) , 2013 European

Conference_Location

Grenoble

Type

conf

Filename

6698648