Assembly and embedding of ultra-thin chips in polymers

In this paper, a novel two polymer composite (benzocyclobutene and polyimide) ultra-thin chip imbedding approach is demonstrated. Detailed processing steps including the formation of electrical interconnections by a conventional metallization process and pre-treatment of the substrate to facilitate the delamination of the embedded chip stack are discussed. The fabrication process is intentionally made compatible with conventional industrial IC processing technology to allow for enabling a fine-pitch interconnectivity as well as ease of adoption in the mainstream IC production facilities. In addition, primary electrical and mechanical characterizations of the imbedded chip along with results from numerous early reliability tests on the embedded chips are presented.