• DocumentCode
    665739
  • Title

    Sensor structures generated with combination of SU8 and PCBMEMS

  • Author

    Gassmann, Stefan ; Luque, Antonio ; Perdigones, Francisco Antonio ; Quero, Jose M. ; Pagel, Lienhard

  • Author_Institution
    Dept. of Eng., Jade Univ. of Appl. Sci., Wilhelmshaven, Germany
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    108
  • Lastpage
    112
  • Abstract
    The usage of standard PCBs (Printed Circuit Boards) for the creation of microfluidic systems was already reported. Here the combination of a standard microtechnology using photolithography and photo sensitive layers (SU8) and the PCB MEMS technology is presented. Using PCBs as the substrate the integration of electronics is simple and the substrate is available at low cost. Putting the sophisticated SU8 based micro technology using photolithography on top, new systems can be created. This combination leads to interesting low cost solutions for micro systems. Both technologies deliver their best, in the PCB technology integrated electrodes and electronics can be created while the SU8 technology adds high resolution high aspect-ratio micro systems which are not possible in a PCB implementation. Using this technology combination several sensor structures can be created. In this paper as successful examples an electrochemical sensor cell array and a flow sensor will be presented.
  • Keywords
    electrochemical sensors; flow sensors; microfluidics; microsensors; photolithography; printed circuits; sensor arrays; PCB MEMS; SU8; aspect-ratio microsystems; electrochemical sensor cell array; flow sensor; microfluidic systems; microtechnology; photolithography; photosensitive layers; printed circuit boards; sensor structures; Copper; Electrodes; Heating; Micromechanical devices; Substrates; Wheels; Wires; PCB; PCB MEMS; SU8; fluidics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6699119
  • Filename
    6699119