DocumentCode
665838
Title
Electro-thermal modeling of SiC power devices for circuit simulation
Author
Shan Yin ; Tao Wang ; Tseng, King-Jet ; Jiyun Zhao ; Xiaolei Hu
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2013
fDate
10-13 Nov. 2013
Firstpage
718
Lastpage
723
Abstract
The behavior-based electro-thermal models for commercial SiC Schottky diode and SiC MOSFET have been developed for circuit simulator PSpice over a wide range of temperature. The Foster RC network is used for thermal modeling and coupled with the electrical modeling by the interaction between power loss and junction temperature. Based on the measurement and parameters extracted from datasheet, both static and dynamic models are formulated by curve fitting. Some simplifications are introduced during modeling to improve convergence and simulation speed. An all-SiC boost converter is also analyzed by simulation to evaluate the models.
Keywords
MOSFET; SPICE; Schottky diodes; circuit simulation; curve fitting; power convertors; power semiconductor diodes; semiconductor device models; silicon compounds; Foster RC network; SiC MOSFET; SiC Schottky diode; SiC power device; all-SiC boost converter; circuit simulation; circuit simulator PSpice; curve fitting; dynamic model; electrothermal modeling; junction temperature; power loss; static model; Capacitance; Integrated circuit modeling; MOSFET; SPICE; Schottky diodes; Silicon carbide; Temperature; MOSFET; PSpice; Schottky diode; SiC; behavior modeling; electro-thermal;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location
Vienna
ISSN
1553-572X
Type
conf
DOI
10.1109/IECON.2013.6699223
Filename
6699223
Link To Document