• DocumentCode
    665838
  • Title

    Electro-thermal modeling of SiC power devices for circuit simulation

  • Author

    Shan Yin ; Tao Wang ; Tseng, King-Jet ; Jiyun Zhao ; Xiaolei Hu

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    718
  • Lastpage
    723
  • Abstract
    The behavior-based electro-thermal models for commercial SiC Schottky diode and SiC MOSFET have been developed for circuit simulator PSpice over a wide range of temperature. The Foster RC network is used for thermal modeling and coupled with the electrical modeling by the interaction between power loss and junction temperature. Based on the measurement and parameters extracted from datasheet, both static and dynamic models are formulated by curve fitting. Some simplifications are introduced during modeling to improve convergence and simulation speed. An all-SiC boost converter is also analyzed by simulation to evaluate the models.
  • Keywords
    MOSFET; SPICE; Schottky diodes; circuit simulation; curve fitting; power convertors; power semiconductor diodes; semiconductor device models; silicon compounds; Foster RC network; SiC MOSFET; SiC Schottky diode; SiC power device; all-SiC boost converter; circuit simulation; circuit simulator PSpice; curve fitting; dynamic model; electrothermal modeling; junction temperature; power loss; static model; Capacitance; Integrated circuit modeling; MOSFET; SPICE; Schottky diodes; Silicon carbide; Temperature; MOSFET; PSpice; Schottky diode; SiC; behavior modeling; electro-thermal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6699223
  • Filename
    6699223