• DocumentCode
    665931
  • Title

    Steady-state analysis of a 5-level bidirectional buck+boost dc-dc converter

  • Author

    Costa, Levy Ferreira ; Mussa, Samir Ahmad ; Barbi, Ivo

  • Author_Institution
    Power Electron. Inst.-INEP, Fed. Univ. of Santa Catarina-UFSC, Florianopolis, Brazil
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    1290
  • Lastpage
    1295
  • Abstract
    This paper presents a nonisolated multilevel buck+boost dc-dc converter suitable for high voltage and high power application. It is composed by a Buck-type and a Boost-type converters, both multilevel and bidirectional. The main features of proposed converter are: reduced voltage stress across the semiconductors, allowing its use in high voltage; bidirectional power flow; frequency operation of the inductor is a multiple of the switching frequency, reducing the volume of magnetic component. This paper focuses on the five-level structure of the proposed converter, in which the theoretical analysis is carried out and discussed. In order to validate the theoretical analysis, a prototype with 10 kW output power capability, 1 kV to 750 V input-to-output voltage and 20 kHz of switching frequency was constructed and experimented. The results attest the advantages of the new dc-dc topology and it is reported herein.
  • Keywords
    DC-DC power convertors; power semiconductor devices; 5-level bidirectional buck+boost DC-DC converter; bidirectional power flow; dc-dc topology; frequency 20 kHz; frequency operation; high power application; high voltage application; input-to-output voltage; magnetic component volume reduction; nonisolated multilevel buck+boost DC-DC converter; output power capability; power 1 kW; power 10 kW; steady-state analysis; switching frequency; voltage 750 V; voltage stress reduction; Capacitors; Equations; Inductance; Inductors; Prototypes; Steady-state; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6699318
  • Filename
    6699318