Thermal considerations about modern energy saving power-MOSFET: Is the reduced thickness of the silicon a drawback for short high power load conditions?

The trend of the last years to reduce the thickness of modern Power Silicon Chips was suspected to reduce the thermal performance of the MOSFET. This article shows from thermal point of view what happens in a typical packaged Power Switch during a high load condition. These load conditions (typically around one second with currents several times higher than at nominal conditions) are typical for power tools but occur also in a lot of other applications. Calculations and considerations are compared to Simulations done with the Finite Element Methode.