DocumentCode
666094
Title
FPGA embedded hardware system for finger vein biometric recognition
Author
Khalil-Hani, M. ; Lee, Y.H.
Author_Institution
VeCAD Res. Lab., Univ. Teknol. Malaysia, Skudai, Malaysia
fYear
2013
fDate
10-13 Nov. 2013
Firstpage
2273
Lastpage
2278
Abstract
Vein biometrics is emerging and gaining popularity over other types of biometric systems due to its strengths of low forgery risk, aliveness detection, non-invasive data acquisition as well as stable over long period. This paper presents a novel design of an embedded finger vein biometric recognition hardware system targeted for implementation on a field-programmable gate array (FPGA) platform. A novel streaming architecture for hardware acceleration of window-based image processing application is proposed. To ensure high quality image capture and high recognition accuracy, we introduce an image acquisition subsystem that uses an embedded camera with dynamic illumination based on quality assessment. Experimental results show that the proposed finger vein verification system achieves 0.87% equal error rate (EER) on a database of 500 finger vein images.
Keywords
cameras; data acquisition; embedded systems; field programmable gate arrays; image capture; vein recognition; visual databases; EER; FPGA embedded hardware system; aliveness detection; dynamic illumination; embedded camera; equal error rate; field-programmable gate array platform; finger vein biometric recognition hardware system; finger vein image database; finger vein verification system; forgery risk; hardware acceleration; high quality image capture; image acquisition subsystem; noninvasive data acquisition; quality assessment; streaming architecture; window-based image processing application; Entropy; Field programmable gate arrays; Hardware; Image edge detection; Lighting; Pulse width modulation; Veins; FPGA; biometrics; embedded hardware system; finger vein;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location
Vienna
ISSN
1553-572X
Type
conf
DOI
10.1109/IECON.2013.6699485
Filename
6699485
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