Title :
A new method of planar inductive sensor for industrial application
Author :
Baratella Lugli, Alexandre ; Borsato Rodrigues, Reinaldo ; dias Santos, Max Mauro
Author_Institution :
Ind. Autom. Dept., INATEL - Telecommun. Inst., Santa Rita do Sapucaí, Brazil
Abstract :
Inductive sensors are devices used widely in industry machinery and equipment and also the automation of industrial processes. With the advancement of technology type inductors built with planar microstrip or striplines, new devices have emerged as an inductor resonant element that does not require a ferrite, which was part of this hitherto fundamental for the construction of an inductive sensor. This fact makes such sensors have functioning electronics and characteristics relative to conventional devices. Thus a thorough analysis is needed so that we can determine what type of inductive proximity sensor more convenient for a particular application, either in factory floor automation or building machines. We will present a comparative study between a sensor inductor built conventionally in the conventional manner with increased distance and sensor without ferrite, built with planar technology, based on IEC 60947-5-2 to perform measurements and standardization of tests plus a technical detail among the technologies mentioned. This study will address the five main parameters to choose one or the other inductive. These parameters are measures of sensing distance, lateral and metal free zone, mutual interference, response time and finally switching frequency.
Keywords :
IEC standards; inductive sensors; IEC 60947-5-2; industrial application; industrial process automation; industry equipment; industry machinery; lateral metallic free zone; mutual interference; planar inductive sensor; response time; sensing distance; switching frequency; Coils; Inductors; Oscillators; Sensors; Tin; Topology; Inductive Sensor; Industrial automation; Planar Technology;
Conference_Titel :
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location :
Vienna
DOI :
10.1109/IECON.2013.6699751