Heated area measurement and analysis of optical setups for focused IR light soldering system

Author

Felix, M. ; Medel, A. ; Bravo, Mikel ; Anguiano, C. ; Marquez, Horacio ; Salazar, Daniel

Author_Institution

Eng. Fac., Univ. Autonoma de Baja California (UABC, Mexicali, Mexico

fYear

2013

fDate

10-13 Nov. 2013

Firstpage

3935

Lastpage

3939

Abstract

In this paper, an experimental study of four optical setups used for developing a Focused IR Light Soldering System (FILSS) for Surface Mount Technology (SMT) lead free electronic devices, specifically Ball Grid Arrays (BGA), is presented. The results of this work show captured images of light distribution at the surface area of the BGA under soldering process, compared with the temperature distribution achieved from the proposed optical setups. An analysis of peak temperature and thermal distribution uniformity at the surface of a BGA is presented for each one of the proposed optical setups.

Keywords

ball grid arrays; soldering; surface mount technology; BGA; FILSS; SMT lead free electronic devices; ball grid arrays; focused IR light soldering system; heated area measurement; optical setups; peak temperature analysis; surface mount technology lead free electronic devices; thermal distribution uniformity; Arrays; Lenses; Optical imaging; Optical variables measurement; Soldering; Temperature distribution; Temperature measurement; BGA; SMT; infrared; soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE

Conference_Location

Vienna

ISSN

1553-572X

Type

conf

DOI

10.1109/IECON.2013.6699764

Filename

6699764