• DocumentCode
    666335
  • Title

    Wi-sensors: A low power Wi-Fi solution for temperature and humidity measurement

  • Author

    Hulea, M. ; Mois, George ; Folea, Silviu ; Miclea, Liviu ; Biscu, Vio

  • Author_Institution
    Fac. of Autom. & Comput. Sci., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    4011
  • Lastpage
    4015
  • Abstract
    This paper presents a complete solution for temperature and humidity monitoring using low-power wireless devices, called Wi-Sensors. The Wi-Sensors use a RN-131C Wi-Fi chip as the core microcontroller and 4 configurable digital input/output lines to which temperature sensors can be attached. The digital 1-Wire and DHT22 protocols had been implemented in the embedded application running on the device. Therefore, for temperature and humidity measurements, any of the sensors operating with one of these two protocols can be used. The existing Wi-Fi 802.11 infrastructure can be used in order to send measurement data to remote destinations. The proposed solution also incorporates a data viewer and data processing application, which provides functionalities for alarming the users by email or by SMS in case previously configured limits are exceeded.
  • Keywords
    humidity sensors; low-power electronics; microcontrollers; protocols; temperature sensors; wireless LAN; wireless sensor networks; RN-131C Wi-Fi chip; Wi-Fi 802.11 infrastructure; Wi-sensors; configurable digital input-output lines; core microcontroller; data processing application; data viewer; digital 1-Wire protocols; digital DHT22 protocols; humidity measurement; low power Wi-Fi solution; low-power wireless devices; temperature measurement; temperature sensors; Batteries; IEEE 802.11 Standards; Temperature measurement; Temperature sensors; Wireless communication; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6699777
  • Filename
    6699777