• DocumentCode
    666616
  • Title

    Deployment of a wireless monitoring system for indoor comfort assessment in a smart heat load-shifting context

  • Author

    Leal, Sergio ; Basciotti, Daniele ; Schmidt, Ralf-Roman

  • Author_Institution
    Energy Dept., AIT - Austrian Inst. of Technol., Vienna, Austria
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    5710
  • Lastpage
    5715
  • Abstract
    Peak heat loads influences negatively the performance of district heating (DH) systems. During peak loads fuel based heat boilers (e.g. gas boiler) are used resulting in expensive operational costs and large CO2 emissions. Within the project SmartHeatNet intelligent network operation and control strategies to reduce peak heat loads have been developed and implemented. Demand Side Measures (DSM), such as load shifting/shedding, were investigated and monitoring results from a test case in the DH network of Altenmarkt in Pongau (from the ESCO Salzburg AG) have been used to validate simulations and assess energy savings. To enable a cost effective monitoring process, it is important to allow a rapid deployment of the monitoring system. To fulfil that a field-ready kit consisting of hardware, software, monitoring concepts and accompanying evaluation concepts has been developed. This paper contributes with the definition of a workflow for the deployment of monitoring system. The proposed approach supports the documentation of the monitoring process and reduces the complexity of the deployment procedure. The process model has been validated in realistic test deployment. Focus was the indoor comfort for building users.
  • Keywords
    demand side management; indoor comfort assessment; smart heat load-shifting context; wireless monitoring system; Buildings; Heating; Load modeling; Monitoring; Temperature measurement; Wireless communication; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6700070
  • Filename
    6700070