• DocumentCode
    666708
  • Title

    New 3-level submodules for a modular multilevel converter based HVDC system with advanced features

  • Author

    Sahoo, Abhaya Kumar ; Otero-De-Leon, Ruben ; Chandrasekaran, Visweshwar ; Mohan, Ned

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    6269
  • Lastpage
    6274
  • Abstract
    Modular multilevel converters have emerged as a viable solution over conventional voltage source converters (VSC) for applications in high voltage direct current (HVDC) transmission. Due to modular structure, the converter can reach high number of voltage levels resulting in low switching frequency and near sinusoidal voltage waveforms. This paper proposes new submodule topologies which can result in even higher voltage levels with reduced voltage stress across some switches and lower semiconductor losses. A modified modulation scheme and voltage balancing algorithm is proposed for the new topology and is validated by MATLAB/Simulink simulations. A comprehensive comparative analysis with other available submodule topologies is presented to show the added benefits.
  • Keywords
    HVDC power convertors; HVDC power transmission; power semiconductor switches; switchgear; switching convertors; 3-level submodule topology; HVDC converter system; HVDC transmission; MATLAB-Simulink simulation; VSC; high voltage direct current transmission; modified modulation scheme; modular multilevel converter; semiconductor loss; sinusoidal voltage waveform; switching frequency; voltage balancing algorithm; voltage source converter; voltage stress; Bridge circuits; Capacitors; HVDC transmission; Pulse width modulation; Topology; Voltage control; Carrier based pulse width modulation; HVDC; Modular multilevel converter (MMC); Submodules (SM); Voltage balancing algorithm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6700166
  • Filename
    6700166