DocumentCode :
666708
Title :
New 3-level submodules for a modular multilevel converter based HVDC system with advanced features
Author :
Sahoo, Abhaya Kumar ; Otero-De-Leon, Ruben ; Chandrasekaran, Visweshwar ; Mohan, Ned
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
fYear :
2013
fDate :
10-13 Nov. 2013
Firstpage :
6269
Lastpage :
6274
Abstract :
Modular multilevel converters have emerged as a viable solution over conventional voltage source converters (VSC) for applications in high voltage direct current (HVDC) transmission. Due to modular structure, the converter can reach high number of voltage levels resulting in low switching frequency and near sinusoidal voltage waveforms. This paper proposes new submodule topologies which can result in even higher voltage levels with reduced voltage stress across some switches and lower semiconductor losses. A modified modulation scheme and voltage balancing algorithm is proposed for the new topology and is validated by MATLAB/Simulink simulations. A comprehensive comparative analysis with other available submodule topologies is presented to show the added benefits.
Keywords :
HVDC power convertors; HVDC power transmission; power semiconductor switches; switchgear; switching convertors; 3-level submodule topology; HVDC converter system; HVDC transmission; MATLAB-Simulink simulation; VSC; high voltage direct current transmission; modified modulation scheme; modular multilevel converter; semiconductor loss; sinusoidal voltage waveform; switching frequency; voltage balancing algorithm; voltage source converter; voltage stress; Bridge circuits; Capacitors; HVDC transmission; Pulse width modulation; Topology; Voltage control; Carrier based pulse width modulation; HVDC; Modular multilevel converter (MMC); Submodules (SM); Voltage balancing algorithm;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location :
Vienna
ISSN :
1553-572X
Type :
conf
DOI :
10.1109/IECON.2013.6700166
Filename :
6700166
Link To Document :
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