An acoustic set up for the vibration analysis of silicon wafers

Author

Mitterhofer, S. ; Puhringer, J.D. ; Schlosser, Viktor

Author_Institution

Fac. of Phys., Univ. of Vienna, Vienna, Austria

fYear

2013

fDate

10-13 Nov. 2013

Firstpage

8068

Lastpage

8073

Abstract

Two simple experimental set-ups for acoustic mode analysis of silicon wafers were established. Audible vibratory mode data of single- and multi-crystalline silicon wafers with different thicknesses were investigated. Natural frequency data were found to correlate linearly with the wafer thickness. The observed dependence is theoretically explained by the Kirchhoff plate model. Deviations from the linear variation are attributed to inhomogeneities and mechanical damage of the wafer. Mechanical defects are the reason for an increased fracture probability.

Keywords

photovoltaic cells; solar cells; vibrations; wafer level packaging; Kirchhoff plate model; acoustic mode analysis; acoustic set up; audible vibratory mode data; fracture probability; linear variation; mechanical defects; multicrystalline silicon wafers; natural frequency data; observed dependence; vibration analysis; wafer mechanical damage; wafer thickness; Acoustics; Coils; Frequency measurement; Impedance; Resonant frequency; Silicon; Vibrations; diagnostics; silicon wafer; vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE

Conference_Location

Vienna

ISSN

1553-572X

Type

conf

DOI

10.1109/IECON.2013.6700482

Filename

6700482