• DocumentCode
    667022
  • Title

    Investigation of potential induced degradation (PID) of solar modules from different manufacturers

  • Author

    Schwark, Michael ; Berger, Kevin ; Ebner, Rita ; Ujvari, Gusztav ; Hirschl, C. ; Neumaier, Lukas ; Muhleisen, Wolfgang

  • Author_Institution
    Electr. Energy Syst. - Energy Dept., AIT Austrian Inst. of Technol. GmbH, Vienna, Austria
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    8090
  • Lastpage
    8097
  • Abstract
    In recent years the potential induced degradation (PID) of photovoltaic modules (crystalline and thin film) has attracted a strong interest, as it turned out that PID occurs frequently in PV systems and solar parks. PID is the loss of system power initiated by leakage currents at high voltages. The phenomenon occurs most commonly in photovoltaic (PV) modules that are closest to the negative pol when modules with p-type cells of c-Si are used. Especially in wet weather undesired leakage current decreases the performance of the cells. In this work different standard modules from different manufacturers and customized mini modules with different components were PID tested and analyzed. Additionally, indoor and outdoor degraded modules were investigated. The influence of the encapsulant was seen and it was shown that a simple PID test is not sufficient for life time prediction.
  • Keywords
    elemental semiconductors; reliability; silicon; solar cells; thin film devices; PID analysis; PID testing; PV modules; PV systems; c-silicon p-type cells; crystalline photovoltaic modules; customized mini modules; encapsulant influence; indoor degraded modules; leakage currents; life time prediction; outdoor degraded modules; potential induced degradation; solar modules; solar parks; standard modules; system power loss; thin film photovoltaic modules; wet weather; Degradation; Electric potential; Glass; Leakage currents; Meteorology; Standards; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6700486
  • Filename
    6700486