DocumentCode :
667022
Title :
Investigation of potential induced degradation (PID) of solar modules from different manufacturers
Author :
Schwark, Michael ; Berger, Kevin ; Ebner, Rita ; Ujvari, Gusztav ; Hirschl, C. ; Neumaier, Lukas ; Muhleisen, Wolfgang
Author_Institution :
Electr. Energy Syst. - Energy Dept., AIT Austrian Inst. of Technol. GmbH, Vienna, Austria
fYear :
2013
fDate :
10-13 Nov. 2013
Firstpage :
8090
Lastpage :
8097
Abstract :
In recent years the potential induced degradation (PID) of photovoltaic modules (crystalline and thin film) has attracted a strong interest, as it turned out that PID occurs frequently in PV systems and solar parks. PID is the loss of system power initiated by leakage currents at high voltages. The phenomenon occurs most commonly in photovoltaic (PV) modules that are closest to the negative pol when modules with p-type cells of c-Si are used. Especially in wet weather undesired leakage current decreases the performance of the cells. In this work different standard modules from different manufacturers and customized mini modules with different components were PID tested and analyzed. Additionally, indoor and outdoor degraded modules were investigated. The influence of the encapsulant was seen and it was shown that a simple PID test is not sufficient for life time prediction.
Keywords :
elemental semiconductors; reliability; silicon; solar cells; thin film devices; PID analysis; PID testing; PV modules; PV systems; c-silicon p-type cells; crystalline photovoltaic modules; customized mini modules; encapsulant influence; indoor degraded modules; leakage currents; life time prediction; outdoor degraded modules; potential induced degradation; solar modules; solar parks; standard modules; system power loss; thin film photovoltaic modules; wet weather; Degradation; Electric potential; Glass; Leakage currents; Meteorology; Standards; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location :
Vienna
ISSN :
1553-572X
Type :
conf
DOI :
10.1109/IECON.2013.6700486
Filename :
6700486
Link To Document :
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