Title :
3D-Mesa “Bridge” Silicon Microdosimeter: Charge Collection Study and Application to RBE Studies in
Radiation Therapy
Author :
Tran, Linh T. ; Chartier, Lachlan ; Prokopovich, Dale A. ; Reinhard, Mark I. ; Petasecca, Marco ; Guatelli, Susanna ; Lerch, Michael L. F. ; Perevertaylo, Vladimir L. ; Zaider, Marco ; Matsufuji, Naruhiro ; Jackson, Michael ; Nancarrow, Mitchell ; Rosenfe
Author_Institution :
Centre for Med. Radiat. Phys., Univ. of Wollongong, Wollongong, NSW, Australia
Abstract :
Microdosimetry is an extremely useful technique, used for dosimetry in unknown mixed radiation fields typical of space and aviation, as well as in hadron therapy. A new silicon microdosimeter with 3D sensitive volumes has been proposed to overcome the shortcomings of the conventional Tissue Equivalent Proportional Counter. In this article, the charge collection characteristics of a new 3D mesa microdosimeter were investigated using the ANSTO heavy ion microprobe utilizing 5.5 MeV He2+ and 2 MeV H+ ions. Measurement of the microdosimetric characteristics allowed for the determination of the Relative Biological Effectiveness of the 12C heavy ion therapy beam at the Heavy Ion Medical Accelerator in Chiba (HIMAC), Japan. Well-defined sensitive volumes of the 3D mesa microdosimeter have been observed and the microdosimetric RBE obtained showed good agreement with the TEPC. The new 3D mesa “bridge” microdosimeter is a step forward towards a microdosimeter with fully free-standing 3D sensitive volumes.
Keywords :
dosimetry; proportional counters; radiation therapy; 3D-mesa bridge silicon microdosimeter; 12C radiation therapy; ANSTO heavy ion microprobe; Heavy Ion Medical Accelerator in Chiba; RBE Studies; conventional Tissue Equivalent Proportional Counter; free-standing 3D sensitive volumes; hadron therapy; radiation fields; Arrays; Bridge circuits; Bridges; Etching; Ions; Silicon; Three-dimensional displays; 3D mesa; IBIC; charge collection; heavy ion therapy; microdosimetry; silicon microdosimeter;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2015.2391102