DocumentCode
66770
Title
3-D Conformal Metasurfaces
Author
Gregoire, D.J.
Author_Institution
HRL Labs., LLC, Malibu, CA, USA
Volume
12
fYear
2013
fDate
2013
Firstpage
233
Lastpage
236
Abstract
This letter presents a method for mapping and fabricating metasurfaces on arbitrary 3-D surfaces. Metasurfaces are used for holographic leaky-wave antennas, reflectarray antennas, coatings for soft horn antennas, artificial magnetic conductors, high-impedance surfaces, frequency selective surfaces, electromagnetic band-gap structures, and surface-wave waveguides. They are typically fabricated as 2-D planar structures by printing a grid of metallic patches on a dielectric substrate, but for some applications, it is desirable to create a metasurface conformal to a 3-D surface. The methods presented here can be used with direct-write printing or with standard printed circuit board (PCB) techniques. The PCB method involves mapping the metasurface to a set of 2-D bands that are laminated to a 3-D substrate. As an example, a 3-D conformal, ellipsoidal, holographic, leaky-wave antenna was designed, fabricated, and measured.
Keywords
conductors (electric); conformal antennas; conformal coatings; frequency selective surfaces; holography; horn antennas; leaky wave antennas; metamaterial antennas; photonic band gap; printed circuits; reflectarray antennas; 2D planar structure; 3D conformal metasurface fabrication; 3D conformal metasurface mapping; PCB; artificial magnetic conductor; coating; dielectric substrate; direct-write printing; electromagnetic band gap structure; frequency selective surface; high-impedance surface; holographic leaky wave antenna; metallic patch grid; printed circuit board; reflectarray antenna; soft horn antenna; surface wave waveguide; Antennas; Impedance; Shape; Substrates; Surface impedance; Surface treatment; Surface waves; Artificial impedance surface; artificial magnetic conductor (AMC); high impedance surface; holographic antennas; metafilm; metamaterial; metasurface;
fLanguage
English
Journal_Title
Antennas and Wireless Propagation Letters, IEEE
Publisher
ieee
ISSN
1536-1225
Type
jour
DOI
10.1109/LAWP.2013.2247017
Filename
6469159
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