• DocumentCode
    667861
  • Title

    Characterization of Parylene-C using quartz thickness shear mode (TSM) resonators

  • Author

    Huiyan Wu ; Hongfei Zu ; Xiaotian Li ; Qing-Ming Wang

  • Author_Institution
    Dept. of Mech. Eng. & Mater. Sci., Univ. of Pittsburgh, Pittsburgh, PA, USA
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    787
  • Lastpage
    790
  • Abstract
    Due to its high sensitivity, repeatability and easy connection with electrical measurement systems, Quartz thickness-shear-mode (TSM) resonator is adopted to extract the complex shear modulus of Parylene-C films, which play an important role as both an effective wave-guiding layer and biocompatible interfacial layer in Shear-Horizontal Surface Acoustic Wave Device (SH-SAW, Love Mode). Parylene-C films of different thicknesses were deposited on the surface of AT-cut quartz TSM resonators, and admittance spectrums of these uncoated and coated TSM were measured by an impedance analyzer. Results indicated that the ideal thickness range for extraction was from 2.04 μm to 3.55 μm, effectively avoiding inadequate acoustic deformation as well as excessive electrical-response attenuation. The storage modulus G\´ and loss modulus G" of Parylene-C were 0.155±0.011 GPa and 4.78±0.44 GPa, respectively.
  • Keywords
    crystal resonators; organic compounds; shear modulus; surface acoustic wave devices; thin films; Parylene-C; acoustic deformation; admittance spectrums; electrical-response attenuation; impedance analyzer; loss modulus; quartz thickness shear mode resonators; shear modulus; shear-horizontal surface acoustic wave device; size 2.04 mum to 3.55 mum; storage modulus; Acoustic waves; Films; Fitting; Surface acoustic wave devices; Surface impedance; Surface treatment; Parylene-C; SH-SAW; TLM; TSM; shear modulus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC), 2013 Joint
  • Conference_Location
    Prague
  • Type

    conf

  • DOI
    10.1109/EFTF-IFC.2013.6702223
  • Filename
    6702223