• DocumentCode
    667889
  • Title

    Anomalous DC-current-induced attenuation of Q factor in a silicon contour mode micromechanical resonator

  • Author

    Haoshen Zhu ; Cheng Tu ; Lee, Jeyull

  • Author_Institution
    Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong, China
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    141
  • Lastpage
    144
  • Abstract
    In this work, we report the experimental observation of quality factor (Q) variation in piezoresistively sensed silicon micromechanical resonators vibrating in a lateral contour mode. By fine tuning the bias current, the gradual descending and ascending trend of Q is distinctively observable. It shows a drastic drop in Q by nearly one order of magnitude (from 105 to 104) at a certain bias current level. The observed Q variation is replicable even when applying a capacitive sensing configuration with bias current running through. This anomaly is consistently detected from multiple die samples including resonators aligned along both <;110> and <;100> crystal orientations in the (100) plane. A detailed quantitative study is currently underway.
  • Keywords
    Q-factor; capacitive sensors; crystal resonators; elemental semiconductors; micromechanical resonators; microsensors; silicon; Q factor; anomalous DC-current induced attenuation; bias current level; bias current tuning; capacitive sensing configuration; crystal orientation; lateral contour mode; piezoresistively sensed silicon micromechanical resonators; quality factor; silicon contour mode micromechanical resonator; Current measurement; Micromechanical devices; Oscillators; Piezoresistance; Resonant frequency; Sensors; Temperature measurement; microelectromechanical systems (MEMS); micromechanical resonator; piezoresistive sensing; quality factor; single crystal silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC), 2013 Joint
  • Conference_Location
    Prague
  • Type

    conf

  • DOI
    10.1109/EFTF-IFC.2013.6702253
  • Filename
    6702253