• DocumentCode
    667908
  • Title

    A 2.8 GHz combined mode of vibration aluminum nitride MEMS resonator with high figure of merit exceeding 45

  • Author

    Yu Hui ; Zhenyun Qian ; Rinaldi, Matteo

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    930
  • Lastpage
    932
  • Abstract
    This paper presents the first demonstration of a high frequency (2.8 GHz), lateral field excited (simple two masks fabrication process), combined lateral-thickness extensional mode of vibration aluminum nitride (AlN) micro-electromechanical systems (MEMS) resonator with unprecedentedly high figure of merit (kt2·Q> 45). For the first time, a single interdigital electrode was employed to excite a high frequency mode of vibration in an AlN plate (1.5 μm thick) by making use of both the d33 and d31 AlN piezoelectric coefficients. The resulting MEMS resonator showed high quality factor, Q~2000, (thanks to the high quality AlN film directly deposit on top of the Silicon substrate) and the highest electromechanical coupling coefficient ever reported for AlN MEMS resonators employing a single electrode, kt2~2.5% (thanks to the coherent combination of d33 and d31 coefficients to transduce one single mechanical mode of vibration).
  • Keywords
    III-V semiconductors; UHF devices; aluminium compounds; masks; microfabrication; micromechanical resonators; piezoelectric devices; vibrations; wide band gap semiconductors; AlN; Si; electromechanical coupling coefficient; figure of merit; film deposit; frequency 2.8 GHz; lateral field excitation; lateral-thickness extensional mode; mask fabrication process; microelectromechanical system; piezoelectric coefficient; quality factor; single interdigital electrode; size 1.5 mum; vibration aluminum nitride MEMS resonator; Electrodes; Fabrication; Films; III-V semiconductor materials; Micromechanical devices; Resonant frequency; Vibrations; Aluminum Nitride; Combined Mode; Electromechancial Coupling Coefficient; Figure of Merit; MEMS Resonators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC), 2013 Joint
  • Conference_Location
    Prague
  • Type

    conf

  • DOI
    10.1109/EFTF-IFC.2013.6702272
  • Filename
    6702272