• DocumentCode
    667951
  • Title

    The monolithic 3D advantage: Monolithic 3D is far more than just an alternative to 0.7x scaling

  • Author

    Or-Bach, Zvi

  • Author_Institution
    MonolithIC 3D Inc., San Jose, CA, USA
  • fYear
    2013
  • fDate
    2-4 Oct. 2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Over the last 50 years we have seen tremendous technological and economic progress in semiconductors and microelectronics by following what is known as Moore´s Law. Accordingly about every two years the amount of transistors we can integrate on an IC doubles. A new form of scaling is shaping up as an alternative to maintain the exponential increase in integration - scaling up using monolithic 3D technology. The NAND Flash vendors are the early adopters of this new alternative scaling and are developing multiple variations of products that are scheduled to reach volume production in 2015. In this tutorial we present the advantages of 3D IC technology. Some of these advantages can only be achieved via monolithic 3D. It is possible that this emerging technology could bring back the trend we had previously enjoyed with reductions of cost, decreases in power consumption, and improvements in performance, and bring additional compelling benefits.
  • Keywords
    NAND circuits; flash memories; three-dimensional integrated circuits; 3D IC technology; Moore law; NAND flash vendors; integration-scaling; monolithic 3D advantage; monolithic 3D technology; power consumption; Integrated circuit interconnections; Lithography; Redundancy; Repeaters; Three-dimensional displays; Transistors; Dennard scaling; heterogeneous integration; lithography cost; monolithic 3d; system on chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/3DIC.2013.6702316
  • Filename
    6702316