Title :
Characterization and optimization of a TSV CMP reveal process using a novel wafer inspection technique for detecting sub-monolayer surface contamination
Author :
Chew, Jason ; Mahajan, Uday ; Bajaj, Rajeev ; Mirshad, Iad ; Newcomb, Robert
Author_Institution :
Applied Materials, 10 Science Park Road, Singapore 117684
Abstract :
Through Silicon Vias (TSV) is a key technology for advanced 3DIC packaging, enabling improved device performance, integration of multiple functions in a single package and form factor reduction. TSV reveal CMP is one of the key processes in this integration scheme [1].
Conference_Titel :
3D Systems Integration Conference (3DIC), 2013 IEEE International
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/3DIC.2013.6702372
