Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation

Author

Bieniek, Tomasz ; Janczyk, Grzegorz ; Dobrowolski, Rafal ; Szmigiel, Dariusz ; Ekwinska, Magdalena ; Grabiec, Piotr ; Pawel, Janus ; Zajac, Jozef

Author_Institution

Div. of Silicon Microsyst. & Nanostruct. Technol., Inst. Technol. Elektron. (ITE), Warsaw, Poland

fYear

2013

fDate

2-4 Oct. 2013

Firstpage

1

Lastpage

6

Abstract

This paper discusses important aspects of development process of dedicated test vehicles designed for investigation on thin metal layers reliability by a novel Accelerated Thermo-Mechanical Ageing method (ATMA) [1] being developed now. It is an ongoing research report presenting current state of the R&D works, investigation on ATMA usefulness and its applicability to interconnect reliability evaluation.

Keywords

integrated circuit design; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; micromechanical devices; system-in-package; three-dimensional integrated circuits; 3D SiP interconnects reliability; MEMS-based test structure; R&D; accelerated thermo-mechanical ageing method; thin metal layers reliability; Aging; Integrated circuit interconnections; Measurement by laser beam; Metals; Micromechanical devices; Structural beams; 3D SiP; Accelerated ageing; MEMS test structure;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2013 IEEE International

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/3DIC.2013.6702375

Filename

6702375