DocumentCode :
668881
Title :
Welcome message
fYear :
2013
fDate :
27-30 Oct. 2013
Abstract :
Presents the welcome message from the conference proceedings.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4799-0705-2
Type :
conf
DOI :
10.1109/EPEPS.2013.6703441
Filename :
6703441
Link To Document :
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