Title :
Table of contents
Abstract :
The following topics are dealt with: Millimeter Wave and RF Technologies; 3D Packaging; Power Integrity and Wireless Power Transfer; Advanced CAD Techniques; Macromodeling; and High Speed Links.
Keywords :
electronics packaging; inductive power transmission; millimetre wave devices; 3D packaging; RF technologies; advanced CAD techniques; high speed links; macromodeling; millimeter wave technologies; power Integrity; wireless power transfer;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
DOI :
10.1109/EPEPS.2013.6703453
