• DocumentCode
    668914
  • Title

    Design, implementation and measurement of board-to-board wireless power transfer (WPT) for low voltage applications

  • Author

    Sukjin Kim ; Bumhee Bae ; Sunkyu Kong ; Jung, Daniel H. ; Kim, Jonghoon J. ; Joungho Kim

  • Author_Institution
    Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
  • fYear
    2013
  • fDate
    27-30 Oct. 2013
  • Firstpage
    91
  • Lastpage
    95
  • Abstract
    In this paper, we present measurement results of board-to-board wireless power transfer (WPT) for low voltage applications using resonant coupling. WPT system consists of source coil, receiver coil, rectifier and load on printed circuit board (PCB). Among them, spiral coil is expressed as a simple equivalent circuit, of which the components are calculated using its physical configurations. The measurement result in frequency-domain shows a good correlation with simulation result using the simple equivalent circuit. In addition, CMOS full bridge rectifier with low turn-on voltage is designed and fabricated to be mounted on PCB. In this system, it is observed that turn-on voltage of the rectifier is very small and DC level at the load is sufficient to be adapted to low voltage applications. Consequently, coil-to-coil voltage transfer ratio (VTR) and DC level at the load of board-to-board WPT are achieved to be 0.50 and 1.32V, respectively. Power transfer efficiency of 30% is calculated using circuit simulation.
  • Keywords
    CMOS integrated circuits; coils; equivalent circuits; inductive power transmission; low-power electronics; power measurement; rectifiers; CMOS full bridge rectifier; DC level; board to board wireless power transfer; circuit simulation; coil to coil voltage transfer ratio; efficiency 30 percent; equivalent circuit; low voltage applications; power transfer efficiency; printed circuit board; receiver coil; resonant coupling; source coil; spiral coil; voltage 0.50 V; voltage 1.32 V; Bridge circuits; CMOS integrated circuits; Coils; Integrated circuit modeling; Rectifiers; Spirals; Video recording; CMOS full bridge rectifier; board-to-board level; spiral coil; wireless power transfer (WPT);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-0705-2
  • Type

    conf

  • DOI
    10.1109/EPEPS.2013.6703474
  • Filename
    6703474