Cost effective modeling methodologies and evaluating electrical interaction in FCBGA packages

This paper demonstrates a modeling methodology for the die-to-package connectivity in a Flip-chip Ball Grid Array (FCBGA) so that the die and package are simulated separately instead of co-simulation of the FCBGA structure for saving a computational cost. In addition, a cost saving polynomial regression modeling method is proposed to find electrical behavior for huge and complex package structures. In addition, various types of patterns were simulated to investigate and evaluate electrical interactions between the die and package through C4 bumps.