• DocumentCode
    668935
  • Title

    Accurate characterization of lossy interconnects from TDR waveforms

  • Author

    Ping Liu ; Jingping Zhang ; Jiayuan Fang

  • Author_Institution
    Sigrity R&D, Cadence Design Syst., Inc., Shanghai, China
  • fYear
    2013
  • fDate
    27-30 Oct. 2013
  • Firstpage
    187
  • Lastpage
    190
  • Abstract
    This paper proposes an accurate solution to characterize the lossy interconnects with discontinuities from TDR waveforms. A new lossy peeling algorithm is proposed to determine the interconnect impedance of lossy structures. An efficient fitting algorithm is applied to extract the W-element model of a lossy structure from an initial impedance profile extracted by a lossless peeling algorithm. The proposed method also improves the accuracy of late time response which has been difficult to achieve by previous algorithms. The approach presented in this paper is able to recover the impedance profiles of complicated lossy structures.
  • Keywords
    electric impedance; integrated circuit interconnections; time-domain reflectometry; TDR waveforms; W-element; impedance profiles; interconnect impedance; lossless peeling; lossy interconnects; lossy peeling; lossy structures; time domain reflectometry; Algorithm design and analysis; Impedance; Integrated circuit interconnections; Loss measurement; Power transmission lines; Propagation losses; Transmission line measurements; TDR impedance profile; TDR measurements; W-element model; curve fitting; lossless peeling algorithm; lossy peeling algorithm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-0705-2
  • Type

    conf

  • DOI
    10.1109/EPEPS.2013.6703495
  • Filename
    6703495