DocumentCode
668935
Title
Accurate characterization of lossy interconnects from TDR waveforms
Author
Ping Liu ; Jingping Zhang ; Jiayuan Fang
Author_Institution
Sigrity R&D, Cadence Design Syst., Inc., Shanghai, China
fYear
2013
fDate
27-30 Oct. 2013
Firstpage
187
Lastpage
190
Abstract
This paper proposes an accurate solution to characterize the lossy interconnects with discontinuities from TDR waveforms. A new lossy peeling algorithm is proposed to determine the interconnect impedance of lossy structures. An efficient fitting algorithm is applied to extract the W-element model of a lossy structure from an initial impedance profile extracted by a lossless peeling algorithm. The proposed method also improves the accuracy of late time response which has been difficult to achieve by previous algorithms. The approach presented in this paper is able to recover the impedance profiles of complicated lossy structures.
Keywords
electric impedance; integrated circuit interconnections; time-domain reflectometry; TDR waveforms; W-element; impedance profiles; interconnect impedance; lossless peeling; lossy interconnects; lossy peeling; lossy structures; time domain reflectometry; Algorithm design and analysis; Impedance; Integrated circuit interconnections; Loss measurement; Power transmission lines; Propagation losses; Transmission line measurements; TDR impedance profile; TDR measurements; W-element model; curve fitting; lossless peeling algorithm; lossy peeling algorithm;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location
San Jose, CA
Print_ISBN
978-1-4799-0705-2
Type
conf
DOI
10.1109/EPEPS.2013.6703495
Filename
6703495
Link To Document