DocumentCode
668946
Title
Crosstalk mitigation in dense microstrip wiring using stubby lines
Author
Chhay, San K. ; Kunze, Richard K. ; Yunhui Chu
fYear
2013
fDate
27-30 Oct. 2013
Firstpage
231
Lastpage
234
Abstract
As the demand for low-cost electronic systems increases, reducing printed circuit board (PCB) layer count becomes highly desirable. But layer count reduction often limits the PCB routing layer options of high-speed input/output (I/O) signals, making it more difficult to meet the next-generation product´s performance targets. For example, using densely wired microstrip routing on a PCB helps reduce layer count, but microstrip routing suffers from performance degradation due to increased far-end crosstalk (FEXT). Stub-alternated lines (“stubby lines”) have been proposed to reduce or eliminate FEXT. In this paper simulation results are presented showing improved memory bus performance on densely routed microstrip channels implemented with stubby lines.
Keywords
crosstalk; microstrip components; microstrip lines; printed circuits; crosstalk mitigation; dense microstrip wiring; densely routed microstrip channels; far end crosstalk; layer count reduction; low cost electronic systems; memory bus performance; microstrip routing; printed circuit board layer count; stub alternated lines; stubby lines; Crosstalk; Impedance; Microstrip; Routing; Time-domain analysis; Transmission line measurements; Wiring; crosstalk; microstrip; printed circuit board; stubby line;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location
San Jose, CA
Print_ISBN
978-1-4799-0705-2
Type
conf
DOI
10.1109/EPEPS.2013.6703506
Filename
6703506
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