• DocumentCode
    668946
  • Title

    Crosstalk mitigation in dense microstrip wiring using stubby lines

  • Author

    Chhay, San K. ; Kunze, Richard K. ; Yunhui Chu

  • fYear
    2013
  • fDate
    27-30 Oct. 2013
  • Firstpage
    231
  • Lastpage
    234
  • Abstract
    As the demand for low-cost electronic systems increases, reducing printed circuit board (PCB) layer count becomes highly desirable. But layer count reduction often limits the PCB routing layer options of high-speed input/output (I/O) signals, making it more difficult to meet the next-generation product´s performance targets. For example, using densely wired microstrip routing on a PCB helps reduce layer count, but microstrip routing suffers from performance degradation due to increased far-end crosstalk (FEXT). Stub-alternated lines (“stubby lines”) have been proposed to reduce or eliminate FEXT. In this paper simulation results are presented showing improved memory bus performance on densely routed microstrip channels implemented with stubby lines.
  • Keywords
    crosstalk; microstrip components; microstrip lines; printed circuits; crosstalk mitigation; dense microstrip wiring; densely routed microstrip channels; far end crosstalk; layer count reduction; low cost electronic systems; memory bus performance; microstrip routing; printed circuit board layer count; stub alternated lines; stubby lines; Crosstalk; Impedance; Microstrip; Routing; Time-domain analysis; Transmission line measurements; Wiring; crosstalk; microstrip; printed circuit board; stubby line;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-0705-2
  • Type

    conf

  • DOI
    10.1109/EPEPS.2013.6703506
  • Filename
    6703506