Title :
A novel EBG structure with super-wideband suppression of simultaneous switching noise in high speed circuits
Author :
Tripathi, J.N. ; Mukherjee, Jayanta ; Apte, Prakash R. ; Nagpal, R.K. ; Chhabra, N.K. ; Malik, Rohit
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol. Bombay, Mumbai, India
Abstract :
A novel uniplanar electromagnetic band-gap structure to maintain power integrity by suppressing simultaneous switching noise (SSN) is presented. The EBG structure with stopband from 750 MHz to 5.10 GHz is designed, fabricated and validated using network analyzer. Simulation results are verified by measurements and compared with the earlier published structures. Suppression of resonant cavity modes of power plane by EBG structure is also shown. The adoption of EBG structure in power deliver network is recommended to reduce the high frequency noise coupling between neighboring devices. These structures further help in better EMI/EMC compliance of the product by attenuating the propagation of high frequency noise between devices. The EBG structure usage can be on board, package or at die level.
Keywords :
electromagnetic compatibility; electromagnetic interference; high-speed integrated circuits; interference suppression; periodic structures; photonic band gap; EBG structure; EMI-EMC compliance; SSN suppression; frequency 750 MHz to 5.1 GHz; high frequency noise coupling; high speed circuits; network analyzer; power deliver network; power integrity; power plane; resonant cavity modes suppression; simultaneous switching noise; superwideband suppression; uniplanar electromagnetic bandgap structure; Capacitors; Cavity resonators; Metamaterials; Noise; Periodic structures; Solid modeling; Switches; Cavity Modes; Electromagnetic Band-Gap (EBG) structure; Power Integrity (PI); Simultaneous Switching Noise (SSN);
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
DOI :
10.1109/EPEPS.2013.6703509
