DocumentCode
671178
Title
Fabrication of silicon nitride ion sensitive field-effect transistor (ISFET)
Author
Chong Soon Weng ; Hashim, U. ; Wei-Wen Liu
Author_Institution
Inst. of Nano-Electron. Eng. (INEE), Univ. Malaysia Perlis (UniMAP), Kangar, Malaysia
fYear
2013
fDate
25-27 Sept. 2013
Firstpage
204
Lastpage
207
Abstract
In this work, the fabrication of silicon nitride ion sensitive field-effect transistor is presented. The ISFET structure is similar to metal oxide semiconductor field-effect transistor (MOSFET) but the gate metal electrode is replaced by a layer of ion sensitive material, also known as the sensing membrane. The fabrication process utilized four masks which consist of the source and drain, gate, contacts and metal mask. The buffered oxide etch was used for etching the silicon oxide and silicon nitride as it is easily available in the cleanroom. In this work, the self-aligned method was used to fabricate the ISFET and this method has shortened the fabrication step as compared to conventional fabrication method. The sample was inspected using high powered microscope after each step of the fabrication and has shown convincing results. The result of this work is an ISFET with silicon nitride as the gate material.
Keywords
etching; ion sensitive field effect transistors; silicon compounds; ISFET structure; MOSFET; SiO2-Si3N4; buffered oxide etching; gate metal electrode; metal oxide semiconductor field-effect transistor; self-aligned method; silicon nitride ion sensitive field-effect transistor; silicon oxide; Electrodes; Fabrication; Logic gates; Resists; Sensors; Silicon; Titanium; ISFET; etching; ion sensitive; mask;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro and Nanoelectronics (RSM), 2013 IEEE Regional Symposium on
Conference_Location
Langkawi
Print_ISBN
978-1-4799-1181-3
Type
conf
DOI
10.1109/RSM.2013.6706509
Filename
6706509
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