• DocumentCode
    671178
  • Title

    Fabrication of silicon nitride ion sensitive field-effect transistor (ISFET)

  • Author

    Chong Soon Weng ; Hashim, U. ; Wei-Wen Liu

  • Author_Institution
    Inst. of Nano-Electron. Eng. (INEE), Univ. Malaysia Perlis (UniMAP), Kangar, Malaysia
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    204
  • Lastpage
    207
  • Abstract
    In this work, the fabrication of silicon nitride ion sensitive field-effect transistor is presented. The ISFET structure is similar to metal oxide semiconductor field-effect transistor (MOSFET) but the gate metal electrode is replaced by a layer of ion sensitive material, also known as the sensing membrane. The fabrication process utilized four masks which consist of the source and drain, gate, contacts and metal mask. The buffered oxide etch was used for etching the silicon oxide and silicon nitride as it is easily available in the cleanroom. In this work, the self-aligned method was used to fabricate the ISFET and this method has shortened the fabrication step as compared to conventional fabrication method. The sample was inspected using high powered microscope after each step of the fabrication and has shown convincing results. The result of this work is an ISFET with silicon nitride as the gate material.
  • Keywords
    etching; ion sensitive field effect transistors; silicon compounds; ISFET structure; MOSFET; SiO2-Si3N4; buffered oxide etching; gate metal electrode; metal oxide semiconductor field-effect transistor; self-aligned method; silicon nitride ion sensitive field-effect transistor; silicon oxide; Electrodes; Fabrication; Logic gates; Resists; Sensors; Silicon; Titanium; ISFET; etching; ion sensitive; mask;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro and Nanoelectronics (RSM), 2013 IEEE Regional Symposium on
  • Conference_Location
    Langkawi
  • Print_ISBN
    978-1-4799-1181-3
  • Type

    conf

  • DOI
    10.1109/RSM.2013.6706509
  • Filename
    6706509