Abstract :
Provides an abstract of the plenary presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.
Keywords :
Bonding; Integrated circuits; Light emitting diodes; Packaging; Substrates; Technological innovation;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
Conference_Location :
Taipei
DOI :
10.1109/IMPACT.2013.6706612
