DocumentCode
671277
Title
Plenary speech
fYear
2013
fDate
22-25 Oct. 2013
Firstpage
10
Lastpage
30
Abstract
Provides an abstract of the plenary presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.
Keywords
Bonding; Integrated circuits; Light emitting diodes; Packaging; Substrates; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
Conference_Location
Taipei
ISSN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2013.6706612
Filename
6706612
Link To Document