مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

671279

Title :

[Front and back cover]

fYear :

2013

fDate :

22-25 Oct. 2013

Abstract :

Presents the front and back covers of the proceedings record.

Keywords :

Assembly; Awards activities; Electronics packaging; Integrated circuits; Packaging; Three-dimensional displays;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International

Conference_Location :

Taipei, Taiwan

ISSN :

2150-5934

Type :

conf

DOI :

10.1109/IMPACT.2013.6706615

Filename :

6706615

Link To Document :