مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

671282

Title :

Organizers co organizers sponsors

fYear :

2013

fDate :

22-25 Oct. 2013

Firstpage :

359

Lastpage :

359

Abstract :

The conference organizers greatly appreciate the support of the various corporate sponsors listed.

Keywords :

Conferences; Electronics packaging; Manufacturing; Materials; Packaging; Printed circuits; Societies;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International

Conference_Location :

Taipei, Taiwan

ISSN :

2150-5934

Type :

conf

DOI :

10.1109/IMPACT.2013.6706618

Filename :

6706618

Link To Document :