• DocumentCode
    671282
  • Title

    Organizers co organizers sponsors

  • fYear
    2013
  • fDate
    22-25 Oct. 2013
  • Firstpage
    359
  • Lastpage
    359
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • Keywords
    Conferences; Electronics packaging; Manufacturing; Materials; Packaging; Printed circuits; Societies;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
  • Conference_Location
    Taipei, Taiwan
  • ISSN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2013.6706618
  • Filename
    6706618
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=671282