Title :
The analysis of the thermal resistance structure of LEDs by measuring its transient temperature variation
Author :
Lin Wei-Keng ; Shao-Wen Chen ; Chao Chen-I ; Yu-Cheng Tsai
Author_Institution :
ESS Dept., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
Abstract :
In order to establish a thermal resistance structure diagram for the light-emitting diode (LED), a thermostat state test platform with a T.E.C.-controlled LED board temperature was established. The Transient Thermal Resistance Structure Analysis (TTRS Analysis) software designed and developed for this study was used to analyze its internal structure in order to establish the overall thermal resistance structure of the LED. The study experimented on two different groups of 1W LEDs to measure their Kfactor coefficients and transient temperature changes using the same thermal interface material but four different kinds of thickness when doing the total thermal resistance response tests. The experimental results show the error values were kept to within 10%, indicating extremely high repeatability of the measurement results. In this study, we used three different thermal interface materials to do the total thermal resistance response test. The three repeatability tests for TC-5121 showed the errors are less than 4%; and errors are less than 1% for both X-23-7783D and X-23-7762. During the three repetitive measurements found high repeatability of the measurement results to verify the reproducibility and stability of the measurement system.
Keywords :
light emitting diodes; measurement errors; temperature measurement; thermal resistance; thermostats; Kfactor coefficients; TEC controlled LED board temperature; TTRS analysis; X-23-7762; X-23-7783D; light-emitting diode; measurement stability; power 1 W; repeatability tests; thermal interface material; thermostat state test; transient temperature variation; transient thermal resistance structure analysis; Electrical resistance measurement; Light emitting diodes; Materials; Temperature measurement; Thermal analysis; Thermal resistance; heat resistance; junction temperature; light-emitting diodes; thermal resistance structure;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
Conference_Location :
Taipei
DOI :
10.1109/IMPACT.2013.6706637