DocumentCode :
671305
Title :
WiFi SiP module using IPD Rx Balun applications
Author :
Min-Han Chuang ; Chia-Chu Lai ; Ho-Chuan Lin ; Ming-Fan Tsai ; Chen, Ci ; Yang, En ; Lee, Daewoo
Author_Institution :
Adv. Design & Testing Dept., Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
fYear :
2013
fDate :
22-25 Oct. 2013
Firstpage :
286
Lastpage :
289
Abstract :
A compact WiFi SiP module using IPD (Integrated Passive Device) Rx Balun is proposed. This WiFi SiP module integrates active chip, RF front end circuit, EEPROM and IPD chip as a full system module that can be easily used for 802.11g WLAN application, especially in handheld products like note book or cell phone. The IPD Rx Balun is designed on a silicon substrate, and soldered on substrate with WiFi chip. The IPD Rx Balun is fabricated on a silicon substrate using thin film process to build up low cost, high performance, and high quality passive component of capacitors, and inductors. Two designs of IPD Rx Balun to meet the WiFi module requirement are presented. Their dimensions are all 1.0×0.895×0.5 mm3 (LxWxH). The simulation results show that the baluns achieves 1.0 dB insertion loss and -15 dB return loss between the 2.4-2.5 GHz operation bandwidth. The phase and amplitude imbalances are less than 10° and 2 dB, respectively. Eventually, this SiP module receiving sensitivity is about -73 dBm at 54Mbps data rate, and meet 802.11g spec.
Keywords :
EPROM; baluns; cellular radio; system-in-package; thin films; wireless LAN; 802.11g WLAN; EEPROM; IPD Rx balun; IPD chip; RF front end circuit; bandwidth 2.4 GHz to 2.5 GHz; bit rate 54 Mbit/s; capacitors; cell phone; compact WiFi SiP module; handheld products; inductors; integrated passive device; loss -15 dB; loss 10 dB; note book; passive component; silicon substrate; thin film process; Capacitors; IEEE 802.11 Standards; Impedance matching; Inductors; Radio frequency; Silicon; Topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
Conference_Location :
Taipei
ISSN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2013.6706641
Filename :
6706641
Link To Document :
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