• DocumentCode
    671305
  • Title

    WiFi SiP module using IPD Rx Balun applications

  • Author

    Min-Han Chuang ; Chia-Chu Lai ; Ho-Chuan Lin ; Ming-Fan Tsai ; Chen, Ci ; Yang, En ; Lee, Daewoo

  • Author_Institution
    Adv. Design & Testing Dept., Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
  • fYear
    2013
  • fDate
    22-25 Oct. 2013
  • Firstpage
    286
  • Lastpage
    289
  • Abstract
    A compact WiFi SiP module using IPD (Integrated Passive Device) Rx Balun is proposed. This WiFi SiP module integrates active chip, RF front end circuit, EEPROM and IPD chip as a full system module that can be easily used for 802.11g WLAN application, especially in handheld products like note book or cell phone. The IPD Rx Balun is designed on a silicon substrate, and soldered on substrate with WiFi chip. The IPD Rx Balun is fabricated on a silicon substrate using thin film process to build up low cost, high performance, and high quality passive component of capacitors, and inductors. Two designs of IPD Rx Balun to meet the WiFi module requirement are presented. Their dimensions are all 1.0×0.895×0.5 mm3 (LxWxH). The simulation results show that the baluns achieves 1.0 dB insertion loss and -15 dB return loss between the 2.4-2.5 GHz operation bandwidth. The phase and amplitude imbalances are less than 10° and 2 dB, respectively. Eventually, this SiP module receiving sensitivity is about -73 dBm at 54Mbps data rate, and meet 802.11g spec.
  • Keywords
    EPROM; baluns; cellular radio; system-in-package; thin films; wireless LAN; 802.11g WLAN; EEPROM; IPD Rx balun; IPD chip; RF front end circuit; bandwidth 2.4 GHz to 2.5 GHz; bit rate 54 Mbit/s; capacitors; cell phone; compact WiFi SiP module; handheld products; inductors; integrated passive device; loss -15 dB; loss 10 dB; note book; passive component; silicon substrate; thin film process; Capacitors; IEEE 802.11 Standards; Impedance matching; Inductors; Radio frequency; Silicon; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2013.6706641
  • Filename
    6706641