IC-package co-design by computational thermographics

The full-chip thermal response with different packages is studied in the paper. To enhance the accuracy of the thermal analysis, authentic package models are established to be the package-transfer matrix. Steady-state temperature profiles are utilized to obtain the package-transfer matrix. In addition, a thermal test chip with many discrete hotspots is implemented for a variety of package types to extract the package-transfer matrix. In this paper, we propose a thermal simulation methodology to precisely obtain temperature profiles of chips with packages by using authentic thermal images. The experimental results show that we can use the default package model CBGA in Hotspot to transfer to any other package in the package-transfer matrix quickly and precisely.