• DocumentCode
    671367
  • Title

    Pre announcement

  • fYear
    2013
  • fDate
    22-25 Oct. 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Provides a schedule of conference events and a listing of which papers were presented in each session.
  • Keywords
    Assembly; Materials; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2013.6706703
  • Filename
    6706703
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=671367