DocumentCode
671873
Title
A robust methodology for solder joints extraction
Author
Abdelhameed, Magdy M. ; Awad, Mamoun Adel ; Abd El-Aziz, Hend M.
Author_Institution
Mechatron. Eng. Dept., Ain Shams Univ. Cairo, Cairo, Egypt
fYear
2013
fDate
26-28 Nov. 2013
Firstpage
268
Lastpage
273
Abstract
In Electronic Manufacturing Industry, machine vision systems have been announced to outperform the electrical inspection systems effectively. It supports the Surface Mount Technology (SMT) and improves the diagnostic capabilities. The challenge there is to miniaturize components with high packing density under economic considerations. This paper presents a front-end automatic detection system tackles with the solder joint specularity, illumination variations and recognition misalignment problems. This can be achieved by enhancing the threshold-based segmentation method using Discrete Cosine (DCT).
Keywords
automatic optical inspection; computer vision; discrete cosine transforms; electronic engineering computing; electronics industry; image segmentation; printed circuit manufacture; production engineering computing; solders; surface mount technology; DCT; SMT; diagnostic capability; discrete cosine; electrical inspection systems; electronic manufacturing industry; front-end automatic detection system; illumination variations; machine vision systems; packing density; recognition misalignment problem; robust methodology; solder joint specularity; solder joints extraction; surface mount technology; threshold-based segmentation method; Brightness; Discrete cosine transforms; Image segmentation; Inspection; Lighting; Soldering; Automatic PCB inspection; DCT segmentation; computer vision application; illumination normalization; solder joints segmentation;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Engineering & Systems (ICCES), 2013 8th International Conference on
Conference_Location
Cairo
Print_ISBN
978-1-4799-0078-7
Type
conf
DOI
10.1109/ICCES.2013.6707217
Filename
6707217
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