• DocumentCode
    671873
  • Title

    A robust methodology for solder joints extraction

  • Author

    Abdelhameed, Magdy M. ; Awad, Mamoun Adel ; Abd El-Aziz, Hend M.

  • Author_Institution
    Mechatron. Eng. Dept., Ain Shams Univ. Cairo, Cairo, Egypt
  • fYear
    2013
  • fDate
    26-28 Nov. 2013
  • Firstpage
    268
  • Lastpage
    273
  • Abstract
    In Electronic Manufacturing Industry, machine vision systems have been announced to outperform the electrical inspection systems effectively. It supports the Surface Mount Technology (SMT) and improves the diagnostic capabilities. The challenge there is to miniaturize components with high packing density under economic considerations. This paper presents a front-end automatic detection system tackles with the solder joint specularity, illumination variations and recognition misalignment problems. This can be achieved by enhancing the threshold-based segmentation method using Discrete Cosine (DCT).
  • Keywords
    automatic optical inspection; computer vision; discrete cosine transforms; electronic engineering computing; electronics industry; image segmentation; printed circuit manufacture; production engineering computing; solders; surface mount technology; DCT; SMT; diagnostic capability; discrete cosine; electrical inspection systems; electronic manufacturing industry; front-end automatic detection system; illumination variations; machine vision systems; packing density; recognition misalignment problem; robust methodology; solder joint specularity; solder joints extraction; surface mount technology; threshold-based segmentation method; Brightness; Discrete cosine transforms; Image segmentation; Inspection; Lighting; Soldering; Automatic PCB inspection; DCT segmentation; computer vision application; illumination normalization; solder joints segmentation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Engineering & Systems (ICCES), 2013 8th International Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    978-1-4799-0078-7
  • Type

    conf

  • DOI
    10.1109/ICCES.2013.6707217
  • Filename
    6707217